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The Quintel Q4000 MA (Mask Aligner) is a top and bottom side contact lithography printer with the video-view split field microscope used for fine line lithography do to 1 micron or better. It is capable of processing both 3- and 6-inch substrates.
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The Laurell WS-650S (8.5 inch bowel) Spin Processor is designed for spin coating thin films of a variety of organic and inorganic materials, such as photoresist, zinc oxide, etc. The chemical resistant natural polypropylene chamber holds up to 6 inch wafer and 4 inch square substrate. The WS-650 digital process controller offers easy programming and precise control of the spin speed, acceleration, and time. |
The controller stores up to twenty 51-step programs, with the potential of expansion using the SPIN3000PC software. The rotation speed ranges from 100 to 8000 rpm, with a repeatability of ± 0.5 rpm. The processor is equipped with a 1.75 inch vacuum chuck for 50 through 150mm substrates, a vacuum adapter for 1” ×3” microslides, and a fragment adapter for holding 10mm to 50mm pieces. Click for Spin Coater instructions
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The Dektak 3 Stylus Profilometer can measure small vertical features ranging in height from 10 to 65,000 nm. The height position of the diamond stylus generates an analog signal which is converted into a digital signal stored, analyzed and displayed. The radius of diamond stylus is 12.5 microns, and the horizontal resolution is controlled by the scan speed and scan length. There is an horizontal broadening factor which is a function of stylus radius and of step height. This broadening factor is added to the horizontal dimensions of the steps. The stylus tracking force is factory-set to 50 milligrams. The scanning head contains a viewing camera, a motor driven stylus and analog electronics to detect and amplify the transducer signal. For more information go to:www.veeco.com |
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The March Plasma Systems Model CS-1701 reactive ion etcher serves two purposes in the MCF lab: anisotropic etching and substrate cleaning. Etching of silicon, silicon oxide, and silicon nitride are accomplished by generating a directed fluorine-containing plasma. The highly energetic fluorine species react with the surface to create gas-phase species, thereby etching the surface. Substrate cleaning is accomplished by using an oxygen only plasma. This plasma reacts with organic species but does not affect silicon, silicon oxide, silicon nitride, or metal surfaces.
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The BOC Edwards Auto 306 Metal Evaporation Chamber is a turbo-pumped evaporation system capable of deposition four different materials in one run. The chamber is equipped with substrate heater, plasma cleaner, rotating work piece, and a quartz crystal microbalance thickness monitoring system.
Click for Evaporation Deposition
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The MCF cleanroom has a Kulicke& Soffa Ltd. 4500Series Manual Wire/Wedge Bonder. This bonder creates microscopic connections between electrical components by ultrasonically welding ca. 20 micron wire onto bonding pads. The 4500 bonder can be used with aluminum wire and ribbon.
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The Hirox 3-D Microscope is capable of storing digital images with a variety of optical lenses including a variable angle (25 TO 55 degrees) measured from horizontal) 3-D mode. Top view lenses range from 20X-600X and 3-D lenses range from 20-300X. For more information on how the 3-D lenses work (and for more information about the Hirox microscope system in general) please visit the following website: http://www.caltexsci.com/3Dscope.htm |
